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陶瓷激光切割機-動龍門
  • 高精度切割:設備采用進口激光器,聚焦光斑最小可達5微米,確保切割精度和邊緣光滑度。定位精度可達±3微米,重復精度為±2微米,適合精密切割需求。

  • 高功率激光:切割功率高達150W,切割速度快,能夠適應多種陶瓷材料的切割要求。切割厚度可達1.5毫米,特別適合用於結構陶瓷和性能陶瓷的切割。

  • X/Y/Z三軸運動控製:配備X軸和Y軸的直線電機系統,通過閉環控製保證速度和定位精度,幫助快速高精度的切割操作。Z軸模塊包含切割頭和視覺系統,配備CCD相機用於精確對位,適合復雜圖形的切割。

  • 耐用性與穩定性:大理石平臺確保設備的承載穩定性和耐腐蝕性,供應了良好的物理支撐,適合長時間穩定操作。

  • 可編程操作與人機界面:控製系統具有集成視覺和運動控製性能,配合CNC精密加工設備,可根據編程要求進行自動化切割操作,簡化了操作過程,提高了生产效率。


Product advantage Specification parameter Process application Sample display
Product advantage

控製精度高抗幹擾性強 

同軸CCD定位、激光測高反饋

切割割縫細、石墨化狀況小

光電轉化率高,耗電低

應用於 PCBN 、PCD、氧化鋁、氧化锆、氧化矽、

碳化矽、碳化硼、碳化鋁、氮化矽、氮化硼、

氮化鋁、氧化鎂等陶瓷材料的切割、劃線、打孔。

Specification parameter
激光功率:300W/150W/500W
切割厚度:0-6mm
切割速度:0-100mm/s
行程:300*300mm
頻率:≤0.08m
Process application
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About Us
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Join Us
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Glass laser cutting machine series
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Laser accessories
Solution
Sheet metal working
Semiconductor plastic sealing alloy
Brittle materials like glass
Service Support
Service Support
News
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Industry Information
Molecular Company Dynamics

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